3354cc金沙·集团股份有限公司

DIP

DIP8

DIP14

DIP16

DIP24

Dual In-line Package Pitch 2.54 mm

DIP8

DIP14

DIP16

DIP24 (WIDE)

SOP

SOIC127P600-8

SOIC127P600-14

SOIC127P600-16

Small-outline integrated circuit

Standard 50 mil Pitch SOICs

SOIC-8 (SO-8)

SOIC-14 (SO-14)

SOIC-16 (SO-16)

SOIC127P1030-16

SOIC127P1030-20

SOIC127P1200-24

Small-outline integrated circuit

Nonstandard 50 mil Pitch SOICs

TSOP65P490-8

TSOP65P640-14

TSOP65P640-16

Thin Small Outline Packages

Pitch 0.65 mm

TSSOP50P490-10

Thin Shrink Small Outline Package

10 Pin Pitch 0.5 mm

TSSOP50P1600-24

TSSOP50P1600-32

TSSOP40P1800-40

Thin Shrink Small Outline Package

Pitch 0.4, 0.5 mm

QFP

TQFP80P900X900-32

TQFP80P1600X1600-64

TQFP65P1200X1200-52

TQFP100P1600X1600-44

Thin Quad Flat Package

Height < 1.6 mm

Pitch 0.65, 0.8, 1.0 mm

TSQFP50P700X700-32

TSQFP50P900X900-48

TSQFP40P900X900-64

TSQFP40P1200X1200-80

Thin Shrink Quad Flat Package

Height < 1.6 mm

Pitch 0.4, 0.5 mm

TSQFP40P1600X1600-120

TSQFP40P1600X1600-128

TSQFP50P1600X1600-100

TSQFP50P2200X2200-144

Thin Shrink Quad Flat Package

Height < 1.6 mm

Pitch 0.4, 0.5 mm

Pin >100

PLCC-68

PLCC-68

Plastic Leaded Chip Carrier

PLCC-68

SIM900

SIM900

Ultra compact and reliable wireless module

QFN

QFN50P700X700-44

QFN40P800X800-68

Quad Flat No leads Packages

QFN-44 Pitch 0.5 mm

QFN-68 Pitch 0.4 mm

QFN50P300X300-10-2

QFN50P300X300-10-2

Quad Flat No leads

QFN-12 (10+2 Pin)

SOT50P240-8

SOT50P240-8

SOT Generic Package 0.5 mm Pitch

RESC

RESC1005

RESC1608

RESC2012

RESC3216

Surface Mount Chip Resistor

0402.STEP 1.0mm x 0.5mm

0603.STEP 1.6mm x 0.8mm

0805.STEP 2.0mm x 1.25mm

1206.STEP 3.2mm x 1.6mm

RESM

RESM3,2X1,5

RESM6X2,3

RESM7,5X2,5

RESM9X3,2

Through Hole Resistors

3.2mm x 1.5mm

6.0mm x 2.3mm

7.5mm x 2.5mm

9.0mm x 3.2mm

3224X

3224X

TRIMMER (4.8x3.5x5.1)mm SMD Bourns

3296W

3296W

TRIMMER (9.53x4.83x10.03)mm SMD Bourns

3303W

3303W

TRIMMER (3.75x3.01.55)mm SMD Bourns

SQP

SQP-3

SQP-5

Wirewound Leaded Resistor

3W, 22.00mm x 8.00mm

5W, 22.00mm x 9.50mm

B57164K

B57164K

THERMISTOR NTC RADIAL

CAPC

CAPC1608

CAPC2012

CAPC3216

CAPC3225

CERAMIC CHIP CAPACITORS

0603.STEP 1.60mm x 0.80mm

0805.STEP 2.00mm x 1.20mm

1206.STEP 3.20mm x 1.60mm

1210.STEP 3.20mm x 2.50mm

CAPCP

TC3216-18

TC3528-21

TC6032-28

TC7343-31

Molded Tantalum Surface Mount Capacitors

3.20mm x 1.60mm

3.50mm x 2.80mm

6.00mm x 3.20mm

7.30mm x 4.30mm

CASE A

CASE B

CASE C

CASE D

CASE A.STEP 3.20mm x 1.60mm

CASE B.STEP 3.50mm x 2.80mm

CASE C.STEP 6.00mm x 3.20mm

CASE D.STEP 7.30mm x 4.30mm

ECE

ECE A

ECE B

ECE C

ECE D

SMT Aluminum Electrolytic Capacitors

Size A 3.30mm x 3.30mm h 5.40mm

Size B 4.30mm x 4.30mm h 5.40mm

Size C 5.30mm x 5.30mm h 5.40mm

Size D 6.60mm x 6.60mm h 5.40mm

TZB4A

TZB4A

CAP TRIMMER SMD 4.00mm x 4.00mm

D2Pak (TO-263AB)

D2Pak (TO-263AB)

D-Pak (TO-252AA)

D-Pak (TO-252AA)

I-Pak (TO-251AA)

I-Pak(TO-251AA).Straight

I-Pak(TO-251AA).PCB TH

SMA (DO-214AC)

SMA (DO-214AC)

Transfer-moulded thermo-setting plastic small rectangular surface mounted package; 5.5x2.8 mm